GOM ZEISS Aramis 3D High Speed

Application

• • Continuous determination of strain and deformation in the measuring area
  • Measuring of frequencies, velocities, accelerations
  • Material and component testing
  • Material card development

Advantages

• • Analysis of max strain and breaking elongation after testing
  • Synchronization with conventional data acquisition
  • DIC results matchable with FEM results to optimize simulation
  • Quasi static and dynamic testing
  • Compact and mobile à on-site service possibility

Creaform Handyscan 700

Application

• Reverse engineering
• Analysis of plastic deformation
• Pre and post test comparison

Advantages

• Compact and mobile à on-site service possibility
• Fast calibrations
• Easy and simple Scans

Many post processing Solutions

• Converting data into CAD-files
• Surveyings
• Polygonisations for surface reconstruction